| 1. | Diffusion bonding technology of mosi2 heating element
2发热元件冷热端扩散接合工艺的研究 |
| 2. | Bonding technology for electroless ni - p alloy plating and rubber
合金层与橡胶粘合工艺的研究 |
| 3. | Research progress in bonding technology of tini shape memory alloys
合金形状记忆效应的微观机制研究进展 |
| 4. | Flip chip bonding technology used in modern micro - photoelectron package
现代微光电子封装中的倒装焊技术 |
| 5. | Flip - chip bonding technology
的柔性凸点技术 |
| 6. | As a contrast object , gold wire ball bonding technology was also studied
金丝球键合作为对比研究对象引入本文研究范围。 |
| 7. | An equipment for vacuum wafer bonding was developed based on the wafer bonding technology
摘要基于圆片键合技术，设计了一种在真空条件下进行圆片键合的工艺设备。 |
| 8. | Taiflex has made steady progress in four core technology areas : composition r d , precision coating , bonding technology , and test and inspection methods . taiflex has also crossed into the optical territory
该公司目前在配方研发精密涂布，贴合技术及检测方法四大核心技术上持续精进，并正式跨足光电领域。 |
| 9. | In order to apply the al mmcs into industry , it ' s necessary to study the reliable bonding technology . it ' s paramount significance to investigate the bonding method of sicp / 6061al mmcs
为使其获得更广泛的工业应用，迫切需要开发实用可靠的连接技术，所以研究碳化硅颗粒增强铝基复合材料的连接具有重要的意义。 |
| 10. | The research status quo of diffusion bonding of ceramics to metals is reviewed in this paper , and the emphases are placed on the interface reaction , stress analysis and bonding technology
本文综述了陶瓷与金属扩散连接的研究现状，重点介绍了界面反应研究、残余应力分析和连接工艺研究等内容，并在此基础上指出了研究中所存在的问题。 |
